Istilah-isilah Kode pada Schematic board Laptop

•  C  :CAPASITOR
• D  :DIODA
• L  :INDUKTOR
• PC :POWER CAPASITOR
• PD :POWER DIODES/DIODA
  
• PL :POWER INDUCTOR
• PQ :POWER TRANSISTOR
• PR :POWER RESISTOR
• PU :POWER INTEGRATED CIRCUIT
• Q  :TRANSISTOR
• R  :RESISTOR
• T  : Transformers
• U  :INTEGRATED CIRCUIT
• X  : Terminal strips, terminations, joins
• Y: Crystal(crystal clock oscylator)
• EMI   :Elektromagnetik Interference(GANGGUAN ELEKTROMAGNETIK)
• F :FUSE
• FSEL : Frequency Select Input.
• GND :Ground
• GP    :GROUND PIN
• HDMI:High-Definition Multimedia Interface
• ID:Continuous Drain Current
• IDM  :Pulsed Drain Current
• IIN : Operating Supply Current
• IIN(SHDN): Shutdown Supply Current
• IIN(STBY): Standby Supply Current
• IS     :Continuous Source Current (Diode Conduction)
• IVIN :Battery Supply Current at VIN pin
• JP     :JUMPER POINT
• LCDV:LCD POWER
• LGATE: Lower-side MOSFET gate signal
• AC      :Alternating current
• ACDRV : AC adapter to system-switch driver output
• ACGOOD : Valid adapter active-low detect logic open-drain output
• ACN : Adapter current sense resistor
• ACOP : Input Over-Power Protection
• ACOV: Input Overvoltage Protection
• ACP : Adapter current sense resistor, positive input.
• ALWP :ALWAYS ON POWER
• B+     :AC OR BAT POWER RAIL FOR POWER CIRCUIT
• BATT  :BATTERY
• BOM  :BILL OF MATERIAL MANAGEMENT
• BT      :BUTTON
• CHGEN : Charge enable active-low logic input
• CIN : Input Capacitor
• CLK_EN:LKOCK ENABLE
• CON  :CONECTOR
• CRT     :Cathode ray tube
• DC    :Direct current
• DM    :DIM/DIM SOCKET/SOKET MEMORY/SOKET DDR
• DOCK:DOCKING SOCKET
• PCI :Peripheral Component Interconnect
• PGOOD : Power good open-drain output
• PIR :PRODUCT IMPROVED RECORD
• PSI#:Current indicator input
• PVCC : IC power positive supply
• RTC :REAL TIME CLOCK
• TD :Death Time
• THRM:THERMAL SENSOR
• TMDS:Transition Minimized Differential Signaling(TRANSMISI DATA TEKNOLOGY)
• TP      :TES POINT
• LPC :Low Pin Count
• LVDS:Low-voltage differential signaling(SYSTEM PENSIGNALAN)
• MBAT:MAIN BATTERY
• ODD :OUTPUT DISC DRIVE
• VDD: control power supply
• VDDR  :POWER DDR (VDRAM/VRAM/VMEM)
• VDS    :VOLTAGE DRAIN SOURCE
• VFB ; feedback inputs Power
• VGS :VOLTAGE GATE SOURCES
• VIN : Input Voltage Range
• VIN :ADAPTER POWER SUPLAY(vol_in)
• VL :Power Lock
• VL :voltage across the load/Tegangan beban resistor
• VLDOIN:Power supply of the VTT and VTTREF output stage (to powerMOS).
• VOT :Volt_out
• VRAM:GROUND
• TPAD :THERMAL PAD
• UVLO: Input Undervoltage Lock Out
• V          :RAIL(POWER)
• V+       :PWR LEBIH (+3V=LEBIH DARI 3VOLT)
• VADJ : Output regulation voltage
• VALW  :ALWAYS ON POWER
• VALWP:VALW PAD
• VBAT   :BATTERY POWER
• VCCP  :power chip(ich,graphic chips)
• VCORE:POWER PROCESOR (VCPU)
• VREF:POWER REFERENCES/SCHEMA REFERENCE/PERMINTAAN SKEMA
• VS  :SUITCH POWER
• VS+ :SUPPORT VOLTAGE
• VSB :POWER SWITCH BUTTON
• VSS : Signal ground.
• VSW :POWER SWICT
• VUSB:POWER USB
• VVGA:POWER VGA (VGPX/VGPU/VCVOD)

1. AC      :Alternating current
2. ACDRV : AC adapter to system-switch driver output
3. ACGOOD : Valid adapter active-low detect logic open-drain output
4. ACN : Adapter current sense resistor
5. ACOP : Input Over-Power Protection
6. ACOV: Input Overvoltage Protection
7. ACP : Adapter current sense resistor, positive input.
8. ALWP :ALWAYS ON POWER
9.  B+     :AC OR BAT POWER RAIL FOR POWER CIRCUIT
10. BATT  :BATTERY
11. BOM  :BILL OF MATERIAL MANAGEMENT
12. BT      :BUTTON
13. CHGEN : Charge enable active-low logic input
14. CIN : Input Capacitor
15. CLK_EN:LKOCK ENABLE
16. CON  :CONECTOR
17. CRT     :Cathode ray tube
18. DC    :Direct current
19. DM    :DIM/DIM SOCKET/SOKET MEMORY/SOKET DDR
20. DOCK:DOCKING SOCKET
21. EMI   :Elektromagnetik Interference(GANGGUAN ELEKTROMAGNETIK)
22. F       :FUSE
23. FSEL : Frequency Select Input.
24. GND :Ground
25. GP    :GROUND PIN
26. HDMI:High-Definition Multimedia Interface
27. ID     :Continuous Drain Current
28. IDM  :Pulsed Drain Current
29. IIN : Operating Supply Current
30. IIN(SHDN): Shutdown Supply Current
31. IIN(STBY): Standby Supply Current
32. IS     :Continuous Source Current (Diode Conduction)
33. IVIN :Battery Supply Current at VIN pin
34. JP     :JUMPER POINT
35. LCDV:LCD POWER
36. LGATE: Lower-side MOSFET gate signal
37. LPC :Low Pin Count
38. LVDS:Low-voltage differential signaling(SYSTEM PENSIGNALAN)
39. MBAT:MAIN BATTERY
40. ODD :OUTPUT DISC DRIVE
41. PCI :Peripheral Component Interconnect
42. PGOOD : Power good open-drain output
43. PIR :PRODUCT IMPROVED RECORD
44. PSI#:Current indicator input
45. PVCC : IC power positive supply
46. RTC :REAL TIME CLOCK
47. TD :Death Time
48. THRM:THERMAL SENSOR
49. TMDS:Transition Minimized Differential Signaling(TRANSMISI DATA TEKNOLOGY)
50. TP      :TES POINT
51. TPAD :THERMAL PAD
52. UVLO: Input Undervoltage Lock Out
53. V          :RAIL(POWER)
54. V+       :PWR LEBIH (+3V=LEBIH DARI 3VOLT)
55. VADJ : Output regulation voltage
56. VALW  :ALWAYS ON POWER
57. VALWP:VALW PAD
58. VBAT   :BATTERY POWER
59. VCCP  :power chip(ich,graphic chips)
60. VCORE:POWER PROCESOR (VCPU)
61. VDD: control power supply
62. VDDR  :POWER DDR (VDRAM/VRAM/VMEM)
63. VDS    :VOLTAGE DRAIN SOURCE
64. VFB ; feedback inputs Power
65. VGS :VOLTAGE GATE SOURCES
66. VIN : Input Voltage Range
67. VIN :ADAPTER POWER SUPLAY(vol_in)
68. VL :Power Lock
69. VL :voltage across the load/Tegangan beban resistor
70. VLDOIN:Power supply of the VTT and VTTREF output stage (to powerMOS).
71. VOT :Volt_out
72. VRAM:GROUND
73. VREF:POWER REFERENCES/SCHEMA REFERENCE/PERMINTAAN SKEMA
74. VS  :SUITCH POWER
75. VS+ :SUPPORT VOLTAGE
76. VSB :POWER SWITCH BUTTON
77. VSS : Signal ground.
78. VSW :POWER SWICT
79. VUSB:POWER USB
80. VVGA:POWER VGA (VGPX/VGPU/VCVOD)